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Plastic parts for semiconductor equipment
Plastic parts for semiconductor equipment

Crystal Boat

MOQ: 1 Pieces
Delivery time: 15 Day
High cleanliness and low pollution risk, excellent chemical resistance, lightweight and easy processability, stable insulation and thermal performance, cost-effectiveness and convenient maintenance, design flexibility and customization, strong environmental adaptability
Product Details

Detailed description of semiconductor plastic accessories products

 

1. Product Overview

Semiconductor plastic accessories are high-precision engineering plastic components specially designed for the semiconductor manufacturing, packaging and testing processes. They feature excellent chemical stability, cleanliness and mechanical properties, and are suitable for harsh semiconductor production environments.

 

2. Core features

Material properties

 

High-purity materials: High-performance plastics such as PEEK (polyetheretherketone), PTFE (polytetrafluoroethylene), and PFA (perfluoroalkoxy resin) are adopted, with low precipitation and no metal contamination, conforming to SEMI F57 standards.

 

Chemical resistance: Resistant to acids, alkalis, organic solvents and plasma corrosion.

 

Temperature resistance: Wide operating temperature range (-200°C to +260°C, depending on the material).

 

Low particle generation: Surface finish Ra≤0.2μm, reducing the risk of wafer contamination.

 

Structural design

 

Precision injection molding or machining forming, with a tolerance of ±0.01mm.

 

Modular design supports quick replacement and maintenance.

 

Optional anti-static (ESD) feature, surface resistance 10^6-10^9Ω.

 

3. Typical product types

Wafer processing accessories: Wafer Carriers, Chuck gaskets, FOUP/FOSB linings.

 

Fluid transmission components: High-purity chemical valves, pump body impellers, pipe joints.

 

Packaging components: IC test sockets, BGA packaging brackets, lead frame positioning parts.

 

Cleanroom consumables: Glove box panels, cleanroom-specific tool handles.

 

4. Application scenarios

Insulating components in the previous process: photolithography, etching, CVD/PVD equipment.

 

Post-packaging: Plastic sealing molds, cutting tape fasteners.

 

Testing equipment: Probe card holder, test fixture.

 

5. Industry certification and compliance

Comply with SEMI and ISO Class 1-3 cleanroom standards.

 

RoHS 2.0 and REACH SVHC certification for no hazardous substances.

 

UL94 V-0 flame retardant grade (for some models).

 

6. Customized services

Support customers in customizing sizes, colors, and material formulas (such as adding carbon fiber reinforcement), and provide 3D drawing verification and prototype making.

 

7. Packaging and Transportation

Sealed dust-proof packaging (Class 1000 clean bag).

 

Shockproof packing, with batch number and material report indicated on the label.

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