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Detailed description of semiconductor plastic accessories products
1. Product Overview
Semiconductor plastic accessories are high-precision engineering plastic components specially designed for the semiconductor manufacturing, packaging and testing processes. They feature excellent chemical stability, cleanliness and mechanical properties, and are suitable for harsh semiconductor production environments.
2. Core features
Material properties
High-purity materials: High-performance plastics such as PEEK (polyetheretherketone), PTFE (polytetrafluoroethylene), and PFA (perfluoroalkoxy resin) are adopted, with low precipitation and no metal contamination, conforming to SEMI F57 standards.
Chemical resistance: Resistant to acids, alkalis, organic solvents and plasma corrosion.
Temperature resistance: Wide operating temperature range (-200°C to +260°C, depending on the material).
Low particle generation: Surface finish Ra≤0.2μm, reducing the risk of wafer contamination.
Structural design
Precision injection molding or machining forming, with a tolerance of ±0.01mm.
Modular design supports quick replacement and maintenance.
Optional anti-static (ESD) feature, surface resistance 10^6-10^9Ω.
3. Typical product types
Wafer processing accessories: Wafer Carriers, Chuck gaskets, FOUP/FOSB linings.
Fluid transmission components: High-purity chemical valves, pump body impellers, pipe joints.
Packaging components: IC test sockets, BGA packaging brackets, lead frame positioning parts.
Cleanroom consumables: Glove box panels, cleanroom-specific tool handles.
4. Application scenarios
Insulating components in the previous process: photolithography, etching, CVD/PVD equipment.
Post-packaging: Plastic sealing molds, cutting tape fasteners.
Testing equipment: Probe card holder, test fixture.
5. Industry certification and compliance
Comply with SEMI and ISO Class 1-3 cleanroom standards.
RoHS 2.0 and REACH SVHC certification for no hazardous substances.
UL94 V-0 flame retardant grade (for some models).
6. Customized services
Support customers in customizing sizes, colors, and material formulas (such as adding carbon fiber reinforcement), and provide 3D drawing verification and prototype making.
7. Packaging and Transportation
Sealed dust-proof packaging (Class 1000 clean bag).
Shockproof packing, with batch number and material report indicated on the label.
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