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Electronic semiconductors, photovoltaics, FPD
Electronic semiconductors, photovoltaics, FPD

PEEK IC test substrate

MOQ: 1 Pieces
Delivery time: 15 Day
PEEK IC test sockets (test sockets, test sockets) are important fixtures in the semiconductor testing process. It provides a reliable and mechanically stable connection point, allowing testers to test chips, check for manufacturing defects and component malfunctions without the need for permanent soldering or installation onto circuit boards.
Product Details

PEEK test seat

 

IC test sockets (test sockets, test sockets) are important fixtures in the semiconductor testing process. It provides a reliable and mechanically stable connection point, allowing testers to test chips, check for manufacturing defects and component malfunctions without the need for permanent soldering or installation onto circuit boards.

 

When IC chips are subjected to single-chip inspection, a test socket that remains dimensionally stable at high temperatures and can withstand tens of thousands of contact frictions is required. IC test sockets made of PEEK material have the following better advantages:

 

PEEK can withstand very high static loads at high temperatures, featuring stable high bandwidth, low resistance and low inductance.

 

2. PEEK can maintain excellent dimensional stability over a wide temperature range. It can operate at a high temperature of 260℃ for a long time and adapt to working environments from -40℃ to 125℃, meeting the testing requirements under various extreme conditions and ensuring the high-precision dimensional stability of IC test stands during operation.

 

3. PEEK is of high strength and has extremely high wear resistance. It can withstand tens of thousands of contact frictions of IC chips, ensuring the reliability of IC test stands.

 

 

 

With the development of technology, the transistor density of semiconductor chips is getting higher and higher, and the complexity and integration of related products are growing exponentially. This poses an unprecedented challenge for chip design and development.

 

Meanwhile, as the chip development cycle shortens, the requirement for the success rate of tape-out is getting higher and higher. Any failure is a huge loss for enterprises. In addition, the semiconductor manufacturing process is constantly improving, which requires facing a large number of technical challenges. Semiconductor testing runs through the entire IC industry chain.